Journals associated with the name Thermal Investigations of ICs and Systems (THERMINIC), 2010 16th International Workshop on:
- Investigation of tier-swapping to improve the thermal profile of memory-on-logic 3DICsMelamed, Samson, Thorolfsson, Thorlindur, Adi Srinivasan, Cheng, Edmund, Franzon, Paul, Davis, W. Rhett. Thermal Investigations of ICs and Systems (THERMINIC), 2010 16th International Workshop on, :1-6, 2010.
- Experimental characterization and model validation of thermal hot spots in 3D stacked ICsOprins, H., Cherman, V., Adi Srinivasan, Cupak, M., {Van der Plas}, G., Marchal, P., Vandevelde, B., Cheng, E.. Thermal Investigations of ICs and Systems (THERMINIC), 2010 16th International Workshop on, :1-5, 2010.