TSV redundancy: Architecture and design issues in 3D IC

Ang-Chih Hsieh, TingTing Hwang, Ming-Tung Chang, Min-Hsiu Tsai, Chih-Mou Tseng, Hung-Chun Li. TSV redundancy: Architecture and design issues in 3D IC. In Design, Automation and Test in Europe, DATE 2010, Dresden, Germany, March 8-12, 2010. pages 166-171, IEEE, 2010. [doi]

Abstract

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