Taeyoung Kim, Zeyu Sun, Chase Cook, Hengyang Zhao, Ruiwen Li, Daniel Wong, Sheldon X.-D. Tan. Invited - Cross-layer modeling and optimization for electromigration induced reliability. In Proceedings of the 53rd Annual Design Automation Conference, DAC 2016, Austin, TX, USA, June 5-9, 2016. pages 30, ACM, 2016. [doi]
Abstract is missing.