Investigation of the capacitance deviation due to metal-fills and the effective interconnect geometry modeling

Won-Seok Lee, Keun-Ho Lee, Jin-Kyu Park, Tae-Kyung Kim, Young-Kwan Park, Jeong-Taek Kong. Investigation of the capacitance deviation due to metal-fills and the effective interconnect geometry modeling. In 4th International Symposium on Quality of Electronic Design (ISQED 2003), 24-26 March 2003, San Jose, CA, USA. pages 373-376, IEEE Computer Society, 2003. [doi]

Abstract

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