Wei-Hsun Liao, Chang-Tzu Lin, Sheng-Hsin Fang, Chien-Chia Huang, Hung-Ming Chen, Ding-Ming Kwai, Yung-Fa Chou. Heterogeneous chip power delivery modeling and co-synthesis for practical 3DIC realization. In 22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017, Chiba, Japan, January 16-19, 2017. pages 549-553, IEEE, 2017. [doi]
Abstract is missing.