A four-point-bending-test for the stability assessment of glass frit bonded molded microsensors

K. Nötzold, J. Graf, Roland Müller-Fiedler. A four-point-bending-test for the stability assessment of glass frit bonded molded microsensors. Microelectronics Reliability, 48(8-9):1562-1566, 2008. [doi]

Abstract

Abstract is missing.