Khaled Salah, Alaa El Rouby, Hani Ragai, Yehea I. Ismail. TSV-based on-chip inductive coupling communications. In 2013 IEEE International Symposium on Circuits and Systems (ISCAS2013), Beijing, China, May 19-23, 2013. pages 1672-1675, IEEE, 2013. [doi]
Abstract is missing.