TSV protection: Towards secure 3D-MPSoC

Martha Johanna SepĂșlveda, Guy Gogniat, Daniel Florez, Jean-Philippe Diguet, Ricardo Pires, Marius Strum. TSV protection: Towards secure 3D-MPSoC. In IEEE 6th Latin American Symposium on Circuits & Systems, LASCAS 2015, Montevideo, Uruguay, February 24-27, 2015. pages 1-4, IEEE, 2015. [doi]

@inproceedings{SepulvedaGFDPS15,
  title = {TSV protection: Towards secure 3D-MPSoC},
  author = {Martha Johanna SepĂșlveda and Guy Gogniat and Daniel Florez and Jean-Philippe Diguet and Ricardo Pires and Marius Strum},
  year = {2015},
  doi = {10.1109/LASCAS.2015.7250419},
  url = {http://dx.doi.org/10.1109/LASCAS.2015.7250419},
  researchr = {https://researchr.org/publication/SepulvedaGFDPS15},
  cites = {0},
  citedby = {0},
  pages = {1-4},
  booktitle = {IEEE 6th Latin American Symposium on Circuits & Systems, LASCAS 2015, Montevideo, Uruguay, February 24-27, 2015},
  publisher = {IEEE},
  isbn = {978-1-4799-8332-2},
}