Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound

Y. H. Tian, C. J. Hang, C. Q. Wang, G. Q. Ouyang, D. S. Yang, J. P. Zhao. Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound. Microelectronics Reliability, 51(1):157-165, 2011. [doi]

Abstract

Abstract is missing.