Effects of Al on the failure mechanism of the Sn-Ag-Zn eutectic solder

C. Wei, Y.-C. Liu, L. M. Yu, H. Chen, X. Wang. Effects of Al on the failure mechanism of the Sn-Ag-Zn eutectic solder. Microelectronics Reliability, 50(8):1142-1145, 2010. [doi]

Abstract

Abstract is missing.