Jin-Tai Yan, Yu-Jen Tseng, Chia-Heng Yen. Efficient micro-bump assignment for RDL routing in 3DICs. In 21st IEEE International Conference on Electronics, Circuits and Systems, ICECS 2014, Marseille, France, December 7-10, 2014. pages 195-198, IEEE, 2014. [doi]
Abstract is missing.