Chee Lip Gan - researchr alias

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Viewing Publication 1 - 22 from 22

2024

A Comprehensive Data Retrieval and Correction Approach From 40-nm Flash Memory With Selective Chemical EngravingXiao Mei Zeng, Qing Liu, Chee Lip Gan. tifs, 19:1031-1040, 2024. [doi]

2022

Embedded-EEPROM descrambling via laser-based techniques - A case study on AVR MCUSamuel Chef, Chung Tah Chua, Jing Yun Tay, Jason Cheah, Chee Lip Gan. fdtc 2022: 1-8 [doi]

Selective Staining on Non-Volatile Memory Cells for Data RetrievalXiao Mei Zeng, Qing Liu, Jing Yun Tay, Chee Lip Gan. tifs, 17:1884-1892, 2022. [doi]

2018

Impact of carbon impurities on the initial leakage current of AlGaN/GaN high electron mobility transistorsW. A. Sasangka, Yu Gao, Chee Lip Gan, Carl V. Thompson. mr, 88:393-396, 2018. [doi]

2017

2016

Effects of voltage stress on the single event upset (SEU) response of 65 nm flip flopC. T. Chua, Hock Guan Ong, Kevin Sanchez, Philippe Perdu, Chee Lip Gan. mr, 64:199-203, 2016. [doi]

Comprehensive Laser Sensitivity Profiling and Data Register Bit-Flips for Cryptographic Fault Attacks in 65 Nm FPGAWei He, Jakub Breier, Shivam Bhasin, Dirmanto Jap, Hock Guan Ong, Chee Lip Gan. space 2016: 47-65 [doi]

Evaluation of the corrosion performance of Cu-Al intermetallic compounds and the effect of Pd additionAdeline B. Y. Lim, Wei Jian Neo, Oranna Yauw, Bob Chylak, Chee Lip Gan, Zhong Chen. mr, 56:155-161, 2016. [doi]

Interfacial evolution and bond reliability in thermosonic Pd coated Cu wire bonding on aluminum metallization: Effect of palladium distributionAdeline B. Y. Lim, Chris B. Boothroyd, Oranna Yauw, Bob Chylak, Chee Lip Gan, Zhong Chen. mr, 63:214-223, 2016. [doi]

Atmospheric corrosion resistance of electroplated Ni/Ni-P/Au electronic contactsVinod K. Murugan, Zhigang Jia, Govindo J. Syaranamual, Chee Lip Gan, Yizhong Huang, Zhong Chen. mr, 60:84-92, 2016. [doi]

Role of two-dimensional electron gas (2DEG) in AlGaN/GaN high electron mobility transistor (HEMT) ON-state degradationGovindo J. Syaranamual, W. A. Sasangka, Riko I. Made, S. Arulkumaran, G. I. Ng, S. C. Foo, Chee Lip Gan, Carl V. Thompson. mr, 64:589-593, 2016. [doi]

2015

2014

Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parametersAdeline B. Y. Lim, Andrew C. K. Chang, Oranna Yauw, Bob Chylak, Chee Lip Gan, Zhong Chen. mr, 54(11):2555-2563, 2014. [doi]

Customized glass sealant for ceramic substrates for high temperature electronic applicationAhmed Sharif, Chee Lip Gan, Zhong Chen. mr, 54(12):2905-2910, 2014. [doi]

2012

Experimental characterization and modelling of electromigration lifetime under unipolar pulsed current stressMeng Keong Lim, Jingyuan Lin, Yong Chiang Ee, Chee Mang Ng, Jun Wei, Chee Lip Gan. mr, 52(8):1553-1558, 2012. [doi]

2007

Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizationsSyed M. Alam, Chee Lip Gan, Carl V. Thompson, Donald E. Troxel. mj, 38(4-5):463-473, 2007. [doi]

2005

Electromigration Reliability Comparison of Cu and Al InterconnectsSyed M. Alam, Frank L. Wei, Chee Lip Gan, Carl V. Thompson, Donald E. Troxel. isqed 2005: 303-308 [doi]

2004

Circuit Level Reliability Analysis of Cu InterconnectsSyed M. Alam, Chee Lip Gan, Carl V. Thompson, Donald E. Troxel. isqed 2004: 238-243 [doi]

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