Stefaan Van Huylenbroeck - researchr alias

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Viewing Publication 1 - 8 from 8

2019

Process Complexity and Cost Considerations of Multi-Layer Die StacksDimitrios Velenis, Joeri De Vos, Soon-Wook Kim, Jaber Derakhshandeh, Pieter Bex, Giovanni Capuz, Samuel Suhard, Kenneth June Rebibis, Stefaan Van Huylenbroeck, Erik Jan Marinissen, Alain Phommahaxay, Andy Miller, Gerald Beyer, Geert Van der Plas, Eric Beyne. 3dic 2019: 1-6 [doi]

2018

TSV process-induced MOS reliability degradationYunlong Li, Michele Stucchi, Stefaan Van Huylenbroeck, Geert Van der Plas, Gerald Beyer, Eric Beyne, Kristof Croes. irps 2018: 5 [doi]

2016

Continuity and reliability assessment of a scalable 3×50μm and 2×40μm via-middle TSV moduleStefaan Van Huylenbroeck, Yunlong Li, Michele Stucchi, Lieve Bogaerts, Joeri De Vos, Gerald Beyer, Eric Beyne, Mohand Brouri, Praveen Nalla, Sanjay Gopinath, Matthew Thorum, Joe Richardson, Jengyi Yu. 3dic 2016: 1-4 [doi]

2015

Impact of oxide liner properties on TSV Cu pumping and TSV stressJoke De Messemaeker, O. Varela Pedreira, A. Moussa, Nabi Nabiollahi, Kris Vanstreels, Stefaan Van Huylenbroeck, Harold Philipsen, P. Verdonck, Bart Vandevelde, Ingrid De Wolf, Eric Beyne, Kris Croes. irps 2015: 4 [doi]

2014

2012

Methodology for extracting the characteristic capacitances of a power MOSFET transistor, using conventional on-wafer testing techniquesChristoph Kerner, Ivan Ciofi, Thomas Chiarella, Stefaan Van Huylenbroeck. essderc 2012: 221-225 [doi]

2009

Pushing the speed limits of SiGe: C HBTs up to 0.5 TerahertzStefaan Decoutere, Stefaan Van Huylenbroeck, Bernd Heinemann, Alexander Fox, Pascal Chevalier, Alain Chantre, Thomas Meister, Klaus Aufinger, Michael Schröter. cicc 2009: 347-354 [doi]

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