| 0 | -- | 0 | Nobuaki Miyakawa, Eiri Hashimoto, Takanori Maebashi, Natsuo Nakamura, Yutaka Sacho, Shigeto Nakayama, Shinjiro Toyoda. Multilayer stacking technology using wafer-to-wafer stacked method |
| 0 | -- | 0 | Cesare Ferri, Sherief Reda, R. Iris Bahar. Parametric yield management for 3D ICs: Models and strategies for improvement |
| 0 | -- | 0 | Taeho Kgil, Ali G. Saidi, Nathan L. Binkert, Steven K. Reinhardt, Krisztián Flautner, Trevor N. Mudge. PicoServer: Using 3D stacking technology to build energy efficient servers |
| 0 | -- | 0 | Yong Zhan, Sachin S. Sapatnekar. Automated module assignment in stacked-Vdd designs for high-efficiency power delivery |
| 0 | -- | 0 | Yuchun Ma, Yongxiang Liu, Eren Kursun, Glenn Reinman, Jason Cong. Investigating the effects of fine-grain three-dimensional integration on microarchitecture design |
| 0 | -- | 0 | Yuan Xie, Jason Cong, Paul Franzon. Editorial: Special issue on 3D integrated circuits and microarchitectures |