- Fine grain thermal modeling and experimental validation of 3D-ICsOprins, H., Adi Srinivasan, Cupak, M., Cherman, V., Torregiani, C., Stucchi, M., {Van der Plas}, G., Marchal, P., Vandevelde, B., Cheng, E.. mj, 42(4):572-578, April 2011. [doi]
- Investigation of tier-swapping to improve the thermal profile of memory-on-logic 3DICsMelamed, Samson, Thorolfsson, Thorlindur, Adi Srinivasan, Cheng, Edmund, Franzon, Paul, Davis, W. Rhett. Thermal Investigations of ICs and Systems (THERMINIC), 2010 16th International Workshop on, :1-6, 2010.
- Experimental characterization and model validation of thermal hot spots in 3D stacked ICsOprins, H., Cherman, V., Adi Srinivasan, Cupak, M., {Van der Plas}, G., Marchal, P., Vandevelde, B., Cheng, E.. Thermal Investigations of ICs and Systems (THERMINIC), 2010 16th International Workshop on, :1-5, 2010.
- Fine grain thermal modeling of 3D stacked structuresOprins, H., Cupak, M., {Van der Plas}, G., Marchal, P., Vandevelde, B., Adi Srinivasan, Cheng, E.. Thermal Investigations of ICs and Systems, 2009. THERMINIC 2009. 15th International Workshop on, :45-49, 2009.
- Practical chip-centric electro-thermal simulationsGillon, Renaud, Joris, Patricia, Oprins, Herman, Vandevelde, Bart, Adi Srinivasan, Chandra, Rajit. 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems, (September):220-223, sep 2008. [doi]