Anthony Agnesina, Moritz Brunion, Alberto García Ortiz, Francky Catthoor, Dragomir Milojevic, Manu Komalan, Matheus A. Cavalcante, Samuel Riedel, Luca Benini, Sung Kyu Lim. Hier-3D: A Hierarchical Physical Design Methodology for Face-to-Face-Bonded 3D ICs. In Hai Helen Li, Charles Augustine, Ayse Kivilcim Coskun, Swaroop Ghosh, editors, ISLPED '22: ACM/IEEE International Symposium on Low Power Electronics and Design, Boston, MA, USA, August 1 - 3, 2022. ACM, 2022. [doi]
Abstract is missing.