Ramakanth Alapati, Youssef Travaly, Jan Van Olmen, Ricardo Cotrin Teixeira, Jan Vaes, Marc van Cauwenbergh, Anne Jourdain, Greet Verbinnen, Gino Marcuccilli, Glenn Florence, Shay Wolfling, Christine Pelissier, Haiping Zhang, Jaydeep Sinha, Andreas Machura, Irfan Malik. TSV metrology and inspection challenges. In IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009. pages 1-4, IEEE, 2009. [doi]
@inproceedings{AlapatiTOTVCJVMFWPZSMM09,
title = {TSV metrology and inspection challenges},
author = {Ramakanth Alapati and Youssef Travaly and Jan Van Olmen and Ricardo Cotrin Teixeira and Jan Vaes and Marc van Cauwenbergh and Anne Jourdain and Greet Verbinnen and Gino Marcuccilli and Glenn Florence and Shay Wolfling and Christine Pelissier and Haiping Zhang and Jaydeep Sinha and Andreas Machura and Irfan Malik},
year = {2009},
doi = {10.1109/3DIC.2009.5306573},
url = {http://dx.doi.org/10.1109/3DIC.2009.5306573},
researchr = {https://researchr.org/publication/AlapatiTOTVCJVMFWPZSMM09},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009},
publisher = {IEEE},
}