A review on opportunities brought by 3D-monolithic integration for CMOS device and digital circuit

François Andrieu, Perrine Batude, Laurent Brunet, Claire Fenouillet-Béranger, D. Lattard, Sebastien Thuries, Olivier Billoint, R. Fournel, Maud Vinet. A review on opportunities brought by 3D-monolithic integration for CMOS device and digital circuit. In 2018 International Conference on IC Design & Technology, ICICDT 2018, Otranto, Italy, June 4-6, 2018. pages 141-144, IEEE, 2018. [doi]

Abstract

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