A thermal cycling reliability study of ultrasonically bonded copper wires

Elaheh Arjmand, Pearl A. Agyakwa, Martin R. Corfield, Jianfeng Li, Bassem Mouawad, C. Mark Johnson. A thermal cycling reliability study of ultrasonically bonded copper wires. Microelectronics Reliability, 59:126-133, 2016. [doi]

Abstract

Abstract is missing.