Exploiting Die-to-Die Thermal Coupling in 3-D IC Placement

Krit Athikulwongse, Mongkol Ekpanyapong, Sung Kyu Lim. Exploiting Die-to-Die Thermal Coupling in 3-D IC Placement. IEEE Trans. VLSI Syst., 22(10):2145-2155, 2014. [doi]

Abstract

Abstract is missing.