3D monolithic integration

Perrine Batude, Maud Vinet, Arnaud Pouydebasque, Cyrille Le Royer, Bernard Previtali, Claude Tabone, Jean-Michel Hartmann, Loic Sanchez, Laurence Baud, Veronique Carron, Alain Toffoli, Fabienne Allain, Vincent Mazzocchi, Dominique Lafond, Simon Deleonibus, Olivier Faynot. 3D monolithic integration. In International Symposium on Circuits and Systems (ISCAS 2011), May 15-19 2011, Rio de Janeiro, Brazil. pages 2233-2236, IEEE, 2011. [doi]

@inproceedings{BatudeVPRPTHSBCTAMLDF11,
  title = {3D monolithic integration},
  author = {Perrine Batude and Maud Vinet and Arnaud Pouydebasque and Cyrille Le Royer and Bernard Previtali and Claude Tabone and Jean-Michel Hartmann and Loic Sanchez and Laurence Baud and Veronique Carron and Alain Toffoli and Fabienne Allain and Vincent Mazzocchi and Dominique Lafond and Simon Deleonibus and Olivier Faynot},
  year = {2011},
  doi = {10.1109/ISCAS.2011.5938045},
  url = {http://dx.doi.org/10.1109/ISCAS.2011.5938045},
  researchr = {https://researchr.org/publication/BatudeVPRPTHSBCTAMLDF11},
  cites = {0},
  citedby = {0},
  pages = {2233-2236},
  booktitle = {International Symposium on Circuits and Systems (ISCAS 2011), May 15-19 2011, Rio de Janeiro, Brazil},
  publisher = {IEEE},
}