Electrical and thermal analysis for design exchange formats in three dimensional integrated circuits

Rishik Bazaz, Jianyong Xie, Madhavan Swaminathan. Electrical and thermal analysis for design exchange formats in three dimensional integrated circuits. In International Symposium on Quality Electronic Design, ISQED 2013, Santa Clara, CA, USA, March 4-6, 2013. pages 308-315, IEEE, 2013. [doi]

Abstract

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