Peter Benkart, Alexander Kaiser, Andreas Munding, Markus Bschorr, Hans-Jörg Pfleiderer, Erhard Kohn, Arne Heittmann, Holger Huebner, Ulrich Ramacher. 3D Chip Stack Technology Using Through-Chip Interconnects. IEEE Design & Test of Computers, 22(6):512-518, 2005. [doi]
Abstract is missing.