Mark S. Birrittella, Mark Debbage, Ram Huggahalli, James Kunz, Tom Lovett, Todd Rimmer, Keith D. Underwood, Robert C. Zak. Intel® Omni-path Architecture: Enabling Scalable, High Performance Fabrics. In 23rd IEEE Annual Symposium on High-Performance Interconnects, HOTI 2015, Santa Clara, CA, USA, August 26-28, 2015. pages 1-9, IEEE, 2015. [doi]
@inproceedings{BirrittellaDHKL15,
title = {Intel® Omni-path Architecture: Enabling Scalable, High Performance Fabrics},
author = {Mark S. Birrittella and Mark Debbage and Ram Huggahalli and James Kunz and Tom Lovett and Todd Rimmer and Keith D. Underwood and Robert C. Zak},
year = {2015},
doi = {10.1109/HOTI.2015.22},
url = {http://dx.doi.org/10.1109/HOTI.2015.22},
researchr = {https://researchr.org/publication/BirrittellaDHKL15},
cites = {0},
citedby = {0},
pages = {1-9},
booktitle = {23rd IEEE Annual Symposium on High-Performance Interconnects, HOTI 2015, Santa Clara, CA, USA, August 26-28, 2015},
publisher = {IEEE},
isbn = {978-1-4673-9160-3},
}