Mark S. Birrittella, Mark Debbage, Ram Huggahalli, James Kunz, Tom Lovett, Todd Rimmer, Keith D. Underwood, Robert C. Zak. Intel® Omni-path Architecture: Enabling Scalable, High Performance Fabrics. In 23rd IEEE Annual Symposium on High-Performance Interconnects, HOTI 2015, Santa Clara, CA, USA, August 26-28, 2015. pages 1-9, IEEE, 2015. [doi]
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