Wolf-Ekkehard Blanz, Jorge L. C. Sanz, Eric B. Hinkle. Image analysis methods for solder ball inspection in integrated circuit manufacturing. In Proceedings of the 1987 IEEE International Conference on Robotics and Automation, Raleigh, North Carolina, USA, March 31 - April 3, 1987. pages 509-514, IEEE, 1987. [doi]
Abstract is missing.