Mohammed Bougataya, Oussama Berriah, Ahmed Lakhssassi, Adel Omar Dahmane, Yves Blaquière, Yvon Savaria, Richard Norman, Richard Prytula. Thermo-mechanical analysis of a reconfigurable wafer-scale integrated circuit. In 17th IEEE International Conference on Electronics, Circuits, and Systems, ICECS 2010, Athens, Greece, 12-15 December, 2010. pages 315-318, IEEE, 2010. [doi]
Abstract is missing.