Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development

E. Bourjot, P. Stewart, C. Dubarry, E. Lagoutte, E. Rolland, N. Bresson, G. Romano, D. Scevola, V. Balan, Jérôme Dechamp, Marc Zussy, G. Mauguen, C. Castan, L. Sanchez, Amadine Jouve, F. Fournel, Séverine Cheramy. Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development. In 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019. pages 1-5, IEEE, 2019. [doi]

Abstract

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