E. Bourjot, P. Stewart, C. Dubarry, E. Lagoutte, E. Rolland, N. Bresson, G. Romano, D. Scevola, V. Balan, Jérôme Dechamp, Marc Zussy, G. Mauguen, C. Castan, L. Sanchez, Amadine Jouve, F. Fournel, Séverine Cheramy. Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development. In 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019. pages 1-5, IEEE, 2019. [doi]
@inproceedings{BourjotSDLRBRSB19,
title = {Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development},
author = {E. Bourjot and P. Stewart and C. Dubarry and E. Lagoutte and E. Rolland and N. Bresson and G. Romano and D. Scevola and V. Balan and Jérôme Dechamp and Marc Zussy and G. Mauguen and C. Castan and L. Sanchez and Amadine Jouve and F. Fournel and Séverine Cheramy},
year = {2019},
doi = {10.1109/3DIC48104.2019.9058783},
url = {https://doi.org/10.1109/3DIC48104.2019.9058783},
researchr = {https://researchr.org/publication/BourjotSDLRBRSB19},
cites = {0},
citedby = {0},
pages = {1-5},
booktitle = {2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019},
publisher = {IEEE},
isbn = {978-1-7281-4870-0},
}