Effects of mechanical stress and moisture on packaging interfaces

Stephen L. Buchwalter, Peter J. Brofman, Claudius Feger, Michael A. Gaynes, Kang-Wook Lee, Luis J. Matienzo, David L. Questad. Effects of mechanical stress and moisture on packaging interfaces. IBM Journal of Research and Development, 49(4-5):663-676, 2005. [doi]

Abstract

Abstract is missing.