Tung T. Bui, Naoya Watanabe, Masahiro Aoyagi, Katsuya Kikuchi. Twice-etched silicon approach for via-last through-silicon-via with a Parylene-HT liner. In 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015. IEEE, 2015. [doi]
Abstract is missing.