Zhibo Cao, Matteo Stocchi, Matthias Wietstruck, Federico Garbuglia, Diego Pincini, Mehmet Kaynak. Advanced Thermal Modeling of IC - Package Interaction. In 2020 IEEE Radio and Wireless Symposium, RWS 2020, San Antonio, TX, USA, January 26-29, 2020. pages 326-329, IEEE, 2020. [doi]
Abstract is missing.