Microtransfer-Printed InGaAs/InP HBTs Utilizing a Vertical Metal Sub-Collector Contact

Andrew D. Carter, Miguel E. Urteaga, Petra Rowell, Joshua Bergman, Andrea Arias. Microtransfer-Printed InGaAs/InP HBTs Utilizing a Vertical Metal Sub-Collector Contact. In Device Research Conference, DRC 2019, Ann Arbor, MI, USA, June 23-26, 2019. pages 45-46, IEEE, 2019. [doi]

Abstract

Abstract is missing.