The Case of Big Data Platform Services for Semiconductor Wafer Fabrication Foundries

Andy R. K. Chang, Yu-Ling Chen, Po-Yu Chou, Yen-Zhou Huang, Hung-Chang Hsiao, Tsung-Ting Hsieh, Michael Hsu, Chia-Chee Lee, Hsin-Yin Lee, Yun-Chi Shih, Wei-An Shih, Chien-Hsiang Tang, Chia-Ping Tsai, Kuan-Po Tseng. The Case of Big Data Platform Services for Semiconductor Wafer Fabrication Foundries. In International Conference on Information and Communication Technology Convergence, ICTC 2018, Jeju Island, Korea (South), October 17-19, 2018. pages 41-45, IEEE, 2018. [doi]

@inproceedings{ChangCCHHHHLLSS18,
  title = {The Case of Big Data Platform Services for Semiconductor Wafer Fabrication Foundries},
  author = {Andy R. K. Chang and Yu-Ling Chen and Po-Yu Chou and Yen-Zhou Huang and Hung-Chang Hsiao and Tsung-Ting Hsieh and Michael Hsu and Chia-Chee Lee and Hsin-Yin Lee and Yun-Chi Shih and Wei-An Shih and Chien-Hsiang Tang and Chia-Ping Tsai and Kuan-Po Tseng},
  year = {2018},
  doi = {10.1109/ICTC.2018.8539541},
  url = {https://doi.org/10.1109/ICTC.2018.8539541},
  researchr = {https://researchr.org/publication/ChangCCHHHHLLSS18},
  cites = {0},
  citedby = {0},
  pages = {41-45},
  booktitle = {International Conference on Information and Communication Technology Convergence, ICTC 2018, Jeju Island, Korea (South), October 17-19, 2018},
  publisher = {IEEE},
  isbn = {978-1-5386-5041-7},
}