Fabrication of vertical thin-GaN light-emitting diode by low-temperature Cu/Sn/Ag wafer bonding

Y. J. Chen, C. C. Chang, H. Y. Lin, S. C. Hsu, C. Y. Liu. Fabrication of vertical thin-GaN light-emitting diode by low-temperature Cu/Sn/Ag wafer bonding. Microelectronics Reliability, 52(2):381-384, 2012. [doi]

Abstract

Abstract is missing.