ThPA: Thermal Simulation for Advanced ICs

Bo-Wen Chen, Yong-Han Lin, Chien-Yu Lin, Yu-Min Lee. ThPA: Thermal Simulation for Advanced ICs. In 31st Asia and South Pacific Design Automation Conference, ASP-DAC 2026, Lantau, Hong Kong, January 19-22, 2026. pages 1407-1413, IEEE, 2026. [doi]

Abstract

Abstract is missing.