Wafer Level Chip Scale Package copper pillar probing

Hao Chen, Hung-Chih Lin, Ching-Nen Peng, Min-Jer Wang. Wafer Level Chip Scale Package copper pillar probing. In 2014 International Test Conference, ITC 2014, Seattle, WA, USA, October 20-23, 2014. pages 1-6, IEEE, 2014. [doi]

Abstract

Abstract is missing.