Hao Chen, Hung-Chih Lin, Ching-Nen Peng, Min-Jer Wang. Wafer Level Chip Scale Package copper pillar probing. In 2014 International Test Conference, ITC 2014, Seattle, WA, USA, October 20-23, 2014. pages 1-6, IEEE, 2014. [doi]
@inproceedings{ChenLPW14,
title = {Wafer Level Chip Scale Package copper pillar probing},
author = {Hao Chen and Hung-Chih Lin and Ching-Nen Peng and Min-Jer Wang},
year = {2014},
doi = {10.1109/TEST.2014.7035315},
url = {http://doi.ieeecomputersociety.org/10.1109/TEST.2014.7035315},
researchr = {https://researchr.org/publication/ChenLPW14},
cites = {0},
citedby = {0},
pages = {1-6},
booktitle = {2014 International Test Conference, ITC 2014, Seattle, WA, USA, October 20-23, 2014},
publisher = {IEEE},
isbn = {978-1-4799-4722-5},
}