Isothermal aging effects on the microstructure and solder bump shear strength of eutectic Sn37Pb and Sn3.5Ag solders

W.-M. Chen, Paul McCloskey, S. Cian O Mathuna. Isothermal aging effects on the microstructure and solder bump shear strength of eutectic Sn37Pb and Sn3.5Ag solders. Microelectronics Reliability, 46(5-6):896-904, 2006. [doi]

Abstract

Abstract is missing.