Routability-driven bump assignment for chip-package co-design

Meng-Ling Chen, Tu-Hsiung Tsai, Hung-Ming Chen, Shi-Hao Chen. Routability-driven bump assignment for chip-package co-design. In 19th Asia and South Pacific Design Automation Conference, ASP-DAC 2014, Singapore, January 20-23, 2014. pages 519-524, IEEE, 2014. [doi]

Abstract

Abstract is missing.