On Improving Interconnect Defect Diagnosis Resolution and Yield for Interposer-Based 3-D ICs

Chun-Chuan Chi, Bing-Yang Lin, Cheng-Wen Wu, Min-Jer Wang, Hung-Chih Lin, Ching-Nen Peng. On Improving Interconnect Defect Diagnosis Resolution and Yield for Interposer-Based 3-D ICs. IEEE Design & Test of Computers, 31(4):16-26, 2014. [doi]

@article{ChiLWWLP14,
  title = {On Improving Interconnect Defect Diagnosis Resolution and Yield for Interposer-Based 3-D ICs},
  author = {Chun-Chuan Chi and Bing-Yang Lin and Cheng-Wen Wu and Min-Jer Wang and Hung-Chih Lin and Ching-Nen Peng},
  year = {2014},
  doi = {10.1109/MDAT.2014.2304437},
  url = {http://dx.doi.org/10.1109/MDAT.2014.2304437},
  researchr = {https://researchr.org/publication/ChiLWWLP14},
  cites = {0},
  citedby = {0},
  journal = {IEEE Design & Test of Computers},
  volume = {31},
  number = {4},
  pages = {16-26},
}