Post-bond testing of 2.5D-SICs and 3D-SICs containing a passive silicon interposer base

Chun-Chuan Chi, Erik Jan Marinissen, Sandeep Kumar Goel, Cheng-Wen Wu. Post-bond testing of 2.5D-SICs and 3D-SICs containing a passive silicon interposer base. In Bill Eklow, R. D. (Shawn) Blanton, editors, 2011 IEEE International Test Conference, ITC 2011, Anaheim, CA, USA, September 20-22, 2011. pages 1-10, IEEE, 2011. [doi]

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