Seungman Choi, Cathryn Christiansen, Linjun Cao, James Zhang, Ronald Filippi, Tian Shen, Kong Boon Yeap, Sean Ogden, Haojun Zhang, Bianzhu Fu, Patrick Justison. Effect of metal line width on electromigration of BEOL Cu interconnects. In IEEE International Reliability Physics Symposium, IRPS 2018, Burlingame, CA, USA, March 11-15, 2018. pages 4, IEEE, 2018. [doi]
Abstract is missing.