Three-dimensional impedance engineering for mixed-signal system-on-chip applications

Kyuchul Chong, Xi Zhang, King-Ning Tu, Daquan Huang, Mau-Chung Frank Chang, Ya-Hong Xie. Three-dimensional impedance engineering for mixed-signal system-on-chip applications. In Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, CICC 2005, DoubleTree Hotel, San Jose, California, USA, September 18-21, 2005. pages 663-666, IEEE, 2005. [doi]

Abstract

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