C. S. Chou, W. C. J. Wei, B. H. Liu, A. B. Wang, R. C. Luo. Cu-based alloys for 3DP by melt extrusion process. In IEEE International Conference on Industrial Technology, ICIT 2016, Taipei, Taiwan, March 14-17, 2016. pages 1152-1157, IEEE, 2016. [doi]
Abstract is missing.