Wafer Direct Bonding: From Advanced Substrate Engineering to Future Applications in Micro/Nanoelectronics

Silke H. Christiansen, Rajendra Singh, Ulrich Gosele. Wafer Direct Bonding: From Advanced Substrate Engineering to Future Applications in Micro/Nanoelectronics. Proceedings of the IEEE, 94(12):2060-2106, 2006. [doi]

Abstract

Abstract is missing.