Flexible Packed Stencil Design With Multiple Shaping Apertures and Overlapping Shots for E-beam Lithography

Chris C. N. Chu, Wai-Kei Mak. Flexible Packed Stencil Design With Multiple Shaping Apertures and Overlapping Shots for E-beam Lithography. IEEE Trans. on CAD of Integrated Circuits and Systems, 34(10):1652-1663, 2015. [doi]

Abstract

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