Jason Cong, Guojie Luo, Yiyu Shi. Thermal-aware cell and through-silicon-via co-placement for 3D ICs. In Leon Stok, Nikil D. Dutt, Soha Hassoun, editors, Proceedings of the 48th Design Automation Conference, DAC 2011, San Diego, California, USA, June 5-10, 2011. pages 670-675, ACM, 2011. [doi]
Abstract is missing.