Richard Crisp, Bill Gervasi, Wael Zohni, Bel Haba. Cost-minimized double die DRAM packaging for ultra-high performance DDR3 and DDR4 multi-rank server DIMMs. In Keith A. Bowman, Kamesh V. Gadepally, Pallab Chatterjee, Mark M. Budnik, Lalitha Immaneni, editors, Thirteenth International Symposium on Quality Electronic Design, ISQED 2012, Santa Clara, CA, USA, March 19-21, 2012. pages 437-444, IEEE, 2012. [doi]
Abstract is missing.