A numerical procedure for simulating thermal oxidation diffusion of epoxy molding compounds

Zaifu Cui, Miao Cai, Ruifeng Li, Ping Zhang, Xianping Chen, Dao-Guo Yang. A numerical procedure for simulating thermal oxidation diffusion of epoxy molding compounds. Microelectronics Reliability, 55(9-10):1877-1881, 2015. [doi]

Abstract

Abstract is missing.